AT89C51ED2 - IN PDF

Gate Poly Spacing min. Before a product is released for use, successful qualification testing are required at wafer, device and package level. Each test is performed using wafer process specific structures. Device reliability is covering either dice design and processing aspects. The tests are performed on device under qualification, but generic data may also be considered for reliability calculation. For each package type proposed in the Datasheet, it is verified that qualification data are available.

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Hi all! I use this board in some projects succesfully. So, the board needs an update to change the microcontroller and maintain most of the features that it has. Now that Microchip buys Atmel, obsolescence and samples will not be a problem. Mainly because it shares most of features with the old one and footprint and pinout is almost the same, so replacement is relatively easy to do.

Come in and you can see the new board features, changes and more!! The rest of the features are the same power supply, IO ports, clock speed….. So, the replacement is easy and mainly not traumatic. The auto-ISP function dissapears, also the buffers and signals that allow it.

New board has an extra connector, J3, to connect an external temperature sensor DS18B20 or similar. These are the differences on the schemati side. This allows change the old board with the new one without any problem, either mechanical or electrical.

Jumpers for choosing programming port are eliminated. As always, easy process to ordering, many colours and thickness to choose, good manufacturing and shipping time. And of course, e-test for the boards. With black solder mask, the pads to solder is really easy to view, but is impossible view the tracks: Assembly — Top Layer Assembly — Bottom Layer If you see both boards, are very similar and software runs exactly on both taking care with the memory limitations : New and Old — Top Layer Old and New — Bottom Layer Running test software without problems!

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